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810-015987-101 Edge detection adapter plate

In stock

810-015987-101 Edge detection adapter plate
Data acquisition and processing: The module is able to take data from edge detection sensors and process it using an embedded microcontroller or a dedicated processor. The control system then uses this processed data to determine the exact location of the wafer edge.

Brands:

810-015987-101 Edge detection adapter plate

810-015987-101 Edge Inspection Edge boards are key components in LAM Research semiconductor wafer fabrication facilities, designed specifically for edge inspection applications. It acts as a key interface between the system control circuit and a variety of sensors and actuators, enabling precise and efficient edge detection during wafer processing steps.

Main features:

Edge Detection function: The 810-015987-101 module is designed for edge detection tasks in semiconductor wafer manufacturing. It utilizes advanced algorithms and signal processing techniques to accurately identify and position wafer edges with high precision.

Sensor and actuator interface: This module provides an interface for connecting various sensors and actuators, allowing the control system to collect data from the edge detection sensor and send a control signal to adjust the position and alignment of the device.

Data acquisition and processing: The module is able to take data from edge detection sensors and process it using an embedded microcontroller or a dedicated processor. The control system then uses this processed data to determine the exact location of the wafer edge.

Communication interface: The module may include a communication interface, such as RS-232 or Ethernet, to communicate with higher level control systems and monitoring software.

810-015987-101

810-015987-101

Applications:

810-015987-101 Edge detection Edge boards are primarily used in LAM Research semiconductor wafer fabrication equipment, particularly in applications involving:

Wafer alignment: Precise alignment of wafers to chucks or other reference points during various processing steps ensures accurate positioning and pattern alignment.

Wafer metering: Measurement of wafer size and edge characteristics such as edge roughness and edge profile for quality control and process monitoring.

Wafer inspection: Checks wafer edges for defects such as edge cracks, edge fragmentation and edge contamination to ensure wafer quality and device performance.

810-015987-101 Edge detection adapter plate

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